发明授权
- 专利标题： Airflow path within an electronic module enclosure
- 专利标题（中）： 电子模块外壳内的气流路径
-
申请号： US12138625申请日： 2008-06-13
-
公开(公告)号： US07813120B2公开(公告)日： 2010-10-12
- 发明人: Wade D. Vinson , David W. Sherrod
- 申请人： Wade D. Vinson , David W. Sherrod
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; A47B77/08
摘要：
An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
公开/授权文献
- US20080310107A1 AIRFLOW PATH WITHIN AN ELECTRONIC MODULE ENCLOSURE 公开/授权日：2008-12-18
信息查询
