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公开(公告)号：US08655501B2
公开(公告)日：2014-02-18
申请号：US12540479
申请日：2009-08-13
IPC分类号： G05D23/00
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵和泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US08144458B2
公开(公告)日：2012-03-27
申请号：US12138622
申请日：2008-06-13
CPC分类号： G11B33/142 , G11B33/124 , H05K7/1487
摘要： An electronic module includes an enclosure having a front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
摘要翻译： 电子模块包括具有前表面和后表面的外壳。 电子电路板位于外壳中，处理器安装在电子电路板上。 数据存储设备位于外壳中，使得处理器位于数据存储设备和电子电路板之间。
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公开(公告)号：US07755889B2
公开(公告)日：2010-07-13
申请号：US12138186
申请日：2008-06-12
申请人： Wade D. Vinson , David W. Sherrod , David W. Deis , Steve Novack
发明人： Wade D. Vinson , David W. Sherrod , David W. Deis , Steve Novack
CPC分类号： G06F1/20 , H05K7/20563 , Y10T29/5313
摘要： A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.
摘要翻译： 用于电子模块外壳的中央空气歧管包括前部和后部。 前部包括适于与电子模块通信的开口，后部包括适于与风扇通信的开口。 当电子模块安装在前部时，前部的开口可以打开，而后部的风扇安装在后部时可以打开后部的开口。
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公开(公告)号：US20080310107A1
公开(公告)日：2008-12-18
申请号：US12138625
申请日：2008-06-13
申请人： WADE D. VINSON , David W. Sherrod
发明人： WADE D. VINSON , David W. Sherrod
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
摘要翻译： 外壳在前部区域和后部区域中容纳电子模块。 气流可以通过前部区域中的电子模块传送到集气室。 外壳中的气流将气流从外壳的前部区域转移到容纳在外壳后部区域的电子模块。 气流通过后部区域中的电子模块传送到集气室。
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公开(公告)号：US07817430B2
公开(公告)日：2010-10-19
申请号：US12138189
申请日：2008-06-12
申请人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
发明人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
CPC分类号： H05K7/20736 , H05K7/20181
摘要： An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.
摘要翻译： 电子模块外壳具有带气流开口的框架。 位于气流开口内的门在打开和关闭位置之间枢转，允许分别通过气流开口的最大和最小量的气流。
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公开(公告)号：US07813120B2
公开(公告)日：2010-10-12
申请号：US12138625
申请日：2008-06-13
申请人： Wade D. Vinson , David W. Sherrod
发明人： Wade D. Vinson , David W. Sherrod
CPC分类号： H05K7/20736
摘要： An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
摘要翻译： 外壳在前部区域和后部区域中容纳电子模块。 气流可以通过前部区域中的电子模块传送到集气室。 外壳中的气流将气流从外壳的前部区域转移到容纳在外壳后部区域的电子模块。 气流通过后部区域中的电子模块传送到集气室。
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公开(公告)号：US07599761B2
公开(公告)日：2009-10-06
申请号：US11038723
申请日：2005-01-19
IPC分类号： G05D23/00
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵以及泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US20090306833A1
公开(公告)日：2009-12-10
申请号：US12540479
申请日：2009-08-13
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵和泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US20090016010A1
公开(公告)日：2009-01-15
申请号：US12138622
申请日：2008-06-13
CPC分类号： G11B33/142 , G11B33/124 , H05K7/1487
摘要： An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
摘要翻译： 电子模块包括具有前表面和后表面的外壳。 电子电路板位于外壳中，处理器安装在电子电路板上。 数据存储设备位于外壳中，使得处理器位于数据存储设备和电子电路板之间。
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公开(公告)号：US20080316704A1
公开(公告)日：2008-12-25
申请号：US12138186
申请日：2008-06-12
申请人： WADE D. VINSON , David W. Sherrod , David W. Deis , Steve Novack
发明人： WADE D. VINSON , David W. Sherrod , David W. Deis , Steve Novack
CPC分类号： G06F1/20 , H05K7/20563 , Y10T29/5313
摘要： A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.
摘要翻译： 用于电子模块外壳的中央空气歧管包括前部和后部。 前部包括适于与电子模块通信的开口，后部包括适于与风扇通信的开口。 当电子模块安装在前部时，前部的开口可以打开，而后部的风扇安装在后部时可以打开后部的开口。
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