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公开(公告)号：US09213157B2
公开(公告)日：2015-12-15
申请号：US14361185
申请日：2012-01-06
CPC分类号： G02B6/4292 , G02B6/3897 , G02B6/43 , G02B6/4452 , H04B10/22 , H04B10/225 , H04B10/271 , H04B10/278 , Y10T29/49826
摘要： A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.
摘要翻译： 模块化连接器基础设施包括具有光学连接器的设备连接器模块，以光学连接到系统中相应的电子设备子集。 设备连接器模块可拆卸地连接到电子设备。
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公开(公告)号：US08982565B2
公开(公告)日：2015-03-17
申请号：US12121350
申请日：2008-05-15
CPC分类号： H05K7/1488
摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。
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公开(公告)号：US20140369653A1
公开(公告)日：2014-12-18
申请号：US14368933
申请日：2012-04-11
CPC分类号： G02B6/4459 , G02B6/36 , G02B6/4452 , G02B6/46 , G06F1/183
摘要： In the present idsclosure inter-rack optical plenum may be used to route optical fibers between multiple racks of a system. An intra-rack optical plenum may be coupled to one of the racks and the inter-rack optical plenum. The intra-rack optical plenum may route an optical fiber between a first connector configured to mate with a first device and a second connector conifugred to mate with the inter-rack optical plenum.
摘要翻译： 在目前的闭路机架中，机架间光学增压室可用于在系统的多个机架之间路由光纤。 机架内光学增压室可以联接到机架之一和机架间光学增压室。 机架内光学增压室可以在被配置为与第一设备配合的第一连接器和被配置成与机架间光学增压室配合的第二连接器之间路由光纤。
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公开(公告)号：US07817430B2
公开(公告)日：2010-10-19
申请号：US12138189
申请日：2008-06-12
申请人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
发明人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
CPC分类号： H05K7/20736 , H05K7/20181
摘要： An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.
摘要翻译： 电子模块外壳具有带气流开口的框架。 位于气流开口内的门在打开和关闭位置之间枢转，允许分别通过气流开口的最大和最小量的气流。
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公开(公告)号：US07813120B2
公开(公告)日：2010-10-12
申请号：US12138625
申请日：2008-06-13
申请人： Wade D. Vinson , David W. Sherrod
发明人： Wade D. Vinson , David W. Sherrod
CPC分类号： H05K7/20736
摘要： An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
摘要翻译： 外壳在前部区域和后部区域中容纳电子模块。 气流可以通过前部区域中的电子模块传送到集气室。 外壳中的气流将气流从外壳的前部区域转移到容纳在外壳后部区域的电子模块。 气流通过后部区域中的电子模块传送到集气室。
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公开(公告)号：US07780455B2
公开(公告)日：2010-08-24
申请号：US11669860
申请日：2007-01-31
IPC分类号： H01R12/00
CPC分类号： H05K7/1444 , H05K7/1441 , H05K7/1445
摘要： A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.
摘要翻译： 一个系统包括一个主背板和一个次背板。 主背板具有基本上不含部件的表面区域和可以与其电连接的多个连接器。 次背板可拆卸地与该区域内的主背板配合。 辅助背板具有适于与至少两个电子设备配合的至少两个连接器。 至少两个电子设备通过初级和次级背板通信地互连。
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公开(公告)号：US07599761B2
公开(公告)日：2009-10-06
申请号：US11038723
申请日：2005-01-19
IPC分类号： G05D23/00
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵以及泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US20080310097A1
公开(公告)日：2008-12-18
申请号：US12121613
申请日：2008-05-15
申请人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
发明人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
CPC分类号： H05K7/1488 , H05K7/1492
摘要： A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要翻译： 刀片设备外壳具有被配置为选择性地容纳全高和半高刀片设备的多个配置的机箱，管理员模块和至少一个输入/输出设备。 刀片设备外壳还具有印刷电路板，其包括被配置为将刀片设备电子耦合到管理员模块和至少一个输入/输出设备的被动高速中间面板。
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公开(公告)号：US20080309160A1
公开(公告)日：2008-12-18
申请号：US12153742
申请日：2008-05-23
CPC分类号： H01R31/02 , H01R2201/06 , H05K7/1492 , Y10T307/25
摘要： An apparatus for distributing power to computing modules in a multi module enclosure. The apparatus includes at least one power input module, a plurality of power input cables, a plurality of power conversion modules, and a plurality of computing modules. The at least one power input module is modularly arranged within the multi module enclosure. The plurality of power input cables are electrically connected to and provide power input to the at least one power input module. The plurality of power conversion modules are electrically connected to power outputs of the at least one power input module and are modularly arranged within the multi module enclosure. The plurality of computing modules are electrically connected to power outputs of the power conversion modules and are arranged within the multi module enclosure.
摘要翻译： 一种用于向多模块外壳中的计算模块分配电力的装置。 该装置包括至少一个电源输入模块，多个电力输入电缆，多个电力转换模块和多个计算模块。 所述至少一个电源输入模块被模块化地布置在所述多模块外壳内。 所述多个电力输入电缆电连接到所述至少一个电力输入模块并向所述至少一个电力输入模块提供电力输入。 多个电力转换模块电连接到至少一个电力输入模块的电力输出，并且模块化地布置在多模块外壳内。 多个计算模块电连接到电力转换模块的电源输出端，并被布置在多模块外壳内。
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公开(公告)号：US20140334782A1
公开(公告)日：2014-11-13
申请号：US14361185
申请日：2012-01-06
CPC分类号： G02B6/4292 , G02B6/3897 , G02B6/43 , G02B6/4452 , H04B10/22 , H04B10/225 , H04B10/271 , H04B10/278 , Y10T29/49826
摘要： A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.
摘要翻译： 模块化连接器基础设施包括具有光学连接器的设备连接器模块，以光学连接到系统中相应的电子设备子集。 设备连接器模块可拆卸地连接到电子设备。
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