Invention Grant
- Patent Title: Electromagnetic coupler registration and mating
- Patent Title (中): 电磁耦合器配准和配对
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Application No.: US11771991Application Date: 2007-06-29
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Publication No.: US07815451B2Publication Date: 2010-10-19
- Inventor: Thomas D. Simon , Rajeevan Amirtharajah , John R. Benham , John Critchlow
- Applicant: Thomas D. Simon , Rajeevan Amirtharajah , John R. Benham , John Critchlow
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: H01R13/15
- IPC: H01R13/15
Abstract:
A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.
Public/Granted literature
- US20070287325A1 Electromagnetic Coupler Registration and Mating Public/Granted day:2007-12-13
Information query
