Invention Grant
US07816686B2 Forming silicides with reduced tailing on silicon germanium and silicon
有权
在硅锗和硅上形成具有减少的拖尾的硅化物
- Patent Title: Forming silicides with reduced tailing on silicon germanium and silicon
- Patent Title (中): 在硅锗和硅上形成具有减少的拖尾的硅化物
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Application No.: US11811694Application Date: 2007-06-12
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Publication No.: US07816686B2Publication Date: 2010-10-19
- Inventor: Kuo-Hua Pan , Ken Liao , Augus Tai , Harry Chuang
- Applicant: Kuo-Hua Pan , Ken Liao , Augus Tai , Harry Chuang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; an epitaxial region having at least a portion in the semiconductor substrate and adjacent to the gate stack, wherein the epitaxial region comprises an impurity of a first conductivity type; a first portion of the semiconductor substrate adjoining the epitaxial region, wherein the first portion of the semiconductor substrate is of the first conductivity type; and a second portion of the semiconductor substrate adjoining the first portion. The second portion of the semiconductor substrate is of a second conductivity type opposite the first conductivity type. A silicide region is formed on the epitaxial region and the first and the second portions of the semiconductor substrate.
Public/Granted literature
- US20080308842A1 Forming silicides with reduced tailing on silicon germanium and silicon Public/Granted day:2008-12-18
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