发明授权
- 专利标题： Airflow adjustment in an electronic module enclosure
- 专利标题（中）： 电子模块外壳中的气流调节
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申请号： US12138189申请日： 2008-06-12
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公开(公告)号： US07817430B2公开(公告)日： 2010-10-19
- 发明人: David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
- 申请人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H05K7/20 ; G06F1/20 ; A47G19/08
摘要：
An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.
公开/授权文献
- US20080310100A1 AIRFLOW ADJUSTMENT IN AN ELECTRONIC MODULE ENCLOSURE 公开/授权日：2008-12-18
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