发明授权
- 专利标题: Hierarchical test response compaction for a plurality of logic blocks
- 专利标题(中): 多个逻辑块的分层测试响应压缩
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申请号: US11903913申请日: 2007-09-25
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公开(公告)号: US07818642B2公开(公告)日: 2010-10-19
- 发明人: Kee Sup Kim , Ming Zhang , Avi Kovacs
- 申请人: Kee Sup Kim , Ming Zhang , Avi Kovacs
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Trop, Pruner & Hu, P.C.
- 主分类号: G01R31/3177
- IPC分类号: G01R31/3177 ; G01R31/302
摘要:
In one embodiment, the present invention includes first level matrices, each including m input terminals and n output terminals, each coupled to a processor core, and second level matrices each coupled to the n output terminals of one of the first level matrices, where each of the second level matrices has n input terminals and p output terminals, and the p output terminals of the second level matrices correspond to a compacted output from the multiple processor cores. Other embodiments are described and claimed.
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