发明授权
- 专利标题: Multilayer electronic component systems and methods of manufacture
- 专利标题(中): 多层电子元件系统及制造方法
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申请号: US11993890申请日: 2005-11-23
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公开(公告)号: US07834808B2公开(公告)日: 2010-11-16
- 发明人: Dane Thompson , Guoan Wang , Nickolas D. Kingsley , Ioannis Papapolymerou , Emmanouil M. Tentzeris , Ramanan Bairavasubramanian , Gerald DeJean , RongLin Li
- 申请人: Dane Thompson , Guoan Wang , Nickolas D. Kingsley , Ioannis Papapolymerou , Emmanouil M. Tentzeris , Ramanan Bairavasubramanian , Gerald DeJean , RongLin Li
- 申请人地址: US GA Atlanta
- 专利权人: Georgia Tech Research Corporation
- 当前专利权人: Georgia Tech Research Corporation
- 当前专利权人地址: US GA Atlanta
- 代理机构: Thomas, Kayden, Horstemeyer & Risley, LLP
- 国际申请: PCT/US2005/042749 WO 20051123
- 国际公布: WO2008/030208 WO 20080313
- 主分类号: H01Q1/38
- IPC分类号: H01Q1/38
摘要:
Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
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