发明授权
- 专利标题: Phase change memory cell and method of fabricating
- 专利标题(中): 相变存储单元及其制造方法
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申请号: US11493595申请日: 2006-07-27
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公开(公告)号: US07835177B2公开(公告)日: 2010-11-16
- 发明人: Hong-Hui Hsu , Chien-Min Lee , Wen-Han Wang , Min-Hung Lee , Te-Sheng Chao , Yen Chuo , Yi-Chan Chen , Wei-Su Chen
- 申请人: Hong-Hui Hsu , Chien-Min Lee , Wen-Han Wang , Min-Hung Lee , Te-Sheng Chao , Yen Chuo , Yi-Chan Chen , Wei-Su Chen
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Rabin & Berdo, P.C.
- 优先权: TW94145589A 20051221
- 主分类号: G11C11/00
- IPC分类号: G11C11/00
摘要:
A phase change memory (PCM) cell fabricated by etching a tapered structure into a phase change layer, and planarizing a dielectric layer on the phase change layer until a tip of the tapered structure is exposed for contacting a heating electrode. Therefore, the area of the exposed tip of the phase change layer is controlled to be of an extremely small size, the contact area between the phase change layer and the heating electrode is reduced, thereby lowering the operation current.
公开/授权文献
- US20070138595A1 Phase change memory cell and fabricating method thereof 公开/授权日:2007-06-21
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