Invention Grant
- Patent Title: Phase change memory cell and method of fabricating
- Patent Title (中): 相变存储单元及其制造方法
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Application No.: US11493595Application Date: 2006-07-27
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Publication No.: US07835177B2Publication Date: 2010-11-16
- Inventor: Hong-Hui Hsu , Chien-Min Lee , Wen-Han Wang , Min-Hung Lee , Te-Sheng Chao , Yen Chuo , Yi-Chan Chen , Wei-Su Chen
- Applicant: Hong-Hui Hsu , Chien-Min Lee , Wen-Han Wang , Min-Hung Lee , Te-Sheng Chao , Yen Chuo , Yi-Chan Chen , Wei-Su Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: TW94145589A 20051221
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A phase change memory (PCM) cell fabricated by etching a tapered structure into a phase change layer, and planarizing a dielectric layer on the phase change layer until a tip of the tapered structure is exposed for contacting a heating electrode. Therefore, the area of the exposed tip of the phase change layer is controlled to be of an extremely small size, the contact area between the phase change layer and the heating electrode is reduced, thereby lowering the operation current.
Public/Granted literature
- US20070138595A1 Phase change memory cell and fabricating method thereof Public/Granted day:2007-06-21
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