发明授权
- 专利标题： Wiring board, method for manufacturing same, and semiconductor package
- 专利标题（中）： 接线板，制造方法以及半导体封装
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申请号： US11452933申请日： 2006-06-15
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公开(公告)号： US07838779B2公开(公告)日： 2010-11-23
- 发明人: Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
- 申请人： Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
- 申请人地址： JP Tokyo JP Kanagawa
- 专利权人： NEC Corporation,NEC Electronics Corporation
- 当前专利权人： NEC Corporation,NEC Electronics Corporation
- 当前专利权人地址： JP Tokyo JP Kanagawa
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2005-178415 20050617
- 主分类号： H01R12/04
- IPC分类号： H01R12/04 ; H05K1/11
摘要：
A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.
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