发明授权
- 专利标题： Light radiating conditions selecting method, light radiating conditions selecting device, and soldering device
- 专利标题（中）： 光照条件选择方法，光照条件选择装置，焊接装置
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申请号： US11512824申请日： 2006-08-30
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公开(公告)号： US07847211B2公开(公告)日： 2010-12-07
- 发明人: Tomoko Fukunaka , Masashi Ishiguro , Kenji Takahashi , Shinsuke Kurahashi , Michio Sakurai
- 申请人： Tomoko Fukunaka , Masashi Ishiguro , Kenji Takahashi , Shinsuke Kurahashi , Michio Sakurai
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： RatnerPrestia
- 优先权： JP2005-251167 20050831
- 主分类号： B23K1/005
- IPC分类号： B23K1/005 ; B23K26/20 ; G06F19/00
摘要：
A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.
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