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1.发明授权公开(公告)号：US07847211B2
公开(公告)日：2010-12-07
申请号：US11512824
申请日：2006-08-30
CPC分类号： G06F17/5036 , H05K1/0201 , H05K1/116 , H05K3/3494 , H05K3/429 , H05K2203/107 , H05K2203/304
摘要： A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.
摘要翻译： 一种方法和装置，其能够在焊接工作中适当地选择光辐射条件，其中组件被焊接到板上，施加到焊接点上的光辐射。 用于选择光辐射条件的装置可以包含：a）用于输入信息的输入装置; b）用于存储用于焊接的光辐射功率和光辐射时间上的数据库中的至少任一个的存储器; c）计算器，用于根据通过输入设备输入的信息和存储在存储器中的数据库来确定光照条件; 以及d）用于输出由所述计算器确定的所述光辐射条件的输出装置。 输入设备还可以包括：i）组件; ii）组件焊接在其上的板; 和iii）用于焊接部件的焊料。
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2.发明申请公开(公告)号：US20070050158A1
公开(公告)日：2007-03-01
申请号：US11512824
申请日：2006-08-30
IPC分类号： G06F19/00
CPC分类号： G06F17/5036 , H05K1/0201 , H05K1/116 , H05K3/3494 , H05K3/429 , H05K2203/107 , H05K2203/304
摘要： The light radiating conditions selecting device contains a) an input device for entering at least any one item of information on i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; d) and an output device for outputting the light radiating conditions determined by the calculator.
摘要翻译： 光辐射条件选择装置包括：a）输入装置，用于输入至少一个信息项，i）元件; ii）组件焊接在其上的板; 和iii）用于焊接部件的焊料; b）用于存储用于焊接的光辐射功率和光辐射时间上的数据库中的至少任一个的存储器; c）计算器，用于根据通过输入设备输入的信息和存储在存储器中的数据库来确定光照条件; d）和用于输出由计算器确定的光辐射条件的输出装置。
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公开(公告)号：US07663073B2
公开(公告)日：2010-02-16
申请号：US10833072
申请日：2004-04-28
申请人： Masahiro Sato , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Mamoru Watanabe , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
发明人： Masahiro Sato , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Mamoru Watanabe , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
IPC分类号： B23K26/06
CPC分类号： B23K1/0056 , B23K26/04 , B23K2101/42
摘要： An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path. The optical processing apparatus further includes an actuator for changing a positional relationship between the optical system and the workpiece, a feeder for supplying a solder to the workpiece, a first shifter for moving the processing head in a first direction in parallel to an optical axis of the light emitted from the emitter, a second shifter for positioning the feeder in the first direction away from the processing head when the processing head is moved away from the workpiece by the first shifter, and a third shifter for moving the feeder against the processing head in a second direction perpendicular to the first direction while the processing head is moved by the first shifter. The optical processing apparatus allows the spot of the incident light and the position of soldering to be readily set depending on the configuration of a workpiece and can thus solder the workpiece at higher quality under soldering conditions optimized for the workpiece.
摘要翻译： 光学处理设备包括用于发射光的发射器，用于将光引导到在工件上被处理的位置的第一光路和处理头。 处理头包括设置在第一光路中的光学系统，用于使光成形，具有与第一光路共享的部分的第二光路，引导从工件反射的光的第二光路和用于接收的光接收器 来自第二光路的反射光。 光学处理装置还包括用于改变光学系统和工件之间的位置关系的致动器，用于向工件供应焊料的馈送器，用于沿第一方向平行于第一方向移动处理头的第一移位器， 从发射器发射的光;第二移位器，用于当处理头通过第一移位器移动离开工件时，将馈送器沿第一方向定位成远离处理头;以及第三移位器，用于将馈送器移动到处理头 在垂直于第一方向的第二方向上，当处理头被第一移位器移动时。 光学处理装置允许入射光的点和焊接位置根据工件的构造容易地设定，并且因此可以在针对工件优化的焊接条件下以更高的质量焊接工件。
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公开(公告)号：US07419085B2
公开(公告)日：2008-09-02
申请号：US10842418
申请日：2004-05-11
申请人： Tomoko Fukunaka , Masashi Ishiguro , Mamoru Watanabe , Kazuhiko Yamashita , Masahiro Sato , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
发明人： Tomoko Fukunaka , Masashi Ishiguro , Mamoru Watanabe , Kazuhiko Yamashita , Masahiro Sato , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
IPC分类号： B23K31/02
CPC分类号： B23K1/0056 , B23K31/125
摘要： The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.
摘要翻译： 本发明提供一种光学处理装置，其能够准确地检测在与沉积物相同颜色的背景下粘附到光学装置的沉积物的粘附状态，防止由于焊丝的供给故障而发生焊接不良，并且当前端 焊丝的一部分不能到达处理区域。 该光学处理装置包括用于产生光能的光能输出装置，用于将光能引导到工件中的第一光路，设置在用于成形光能的第一光路中的光学装置，第二光路共享第一 用于将光从工件引导到光接收装置的光路，以及用于改变至少光学装置和工件的相对位置的驱动装置。
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公开(公告)号：US20060261047A1
公开(公告)日：2006-11-23
申请号：US11492824
申请日：2006-07-26
申请人： Tomoko Fukunaka , Masashi Ishiguro , Mamoru Watanabe , Kazuhiko Yamashita , Masahiro Sato , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
发明人： Tomoko Fukunaka , Masashi Ishiguro , Mamoru Watanabe , Kazuhiko Yamashita , Masahiro Sato , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
IPC分类号： B23K1/005
CPC分类号： B23K1/0056 , B23K31/125
摘要： The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.
摘要翻译： 本发明提供一种光学处理装置，其能够准确地检测在与沉积物相同颜色的背景下粘附到光学装置的沉积物的粘附状态，防止由于焊丝的供给故障而发生焊接不良，并且当前端 焊丝的一部分不能到达处理区域。 该光学处理装置包括用于产生光能的光能输出装置，用于将光能引导到工件中的第一光路，设置在用于成形光能的第一光路中的光学装置，第二光路共享第一 用于将光从工件引导到光接收装置的光路，以及用于改变至少光学装置和工件的相对位置的驱动装置。
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公开(公告)号：US07718922B2
公开(公告)日：2010-05-18
申请号：US11492824
申请日：2006-07-26
申请人： Tomoko Fukunaka , Masashi Ishiguro , Mamoru Watanabe , Kazuhiko Yamashita , Masahiro Sato , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
发明人： Tomoko Fukunaka , Masashi Ishiguro , Mamoru Watanabe , Kazuhiko Yamashita , Masahiro Sato , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
CPC分类号： B23K1/0056 , B23K31/125
摘要： An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.
摘要翻译： 一种光学处理装置，其能够准确地检测在与沉积物相同颜色的背景下粘附到光学装置的沉积物的粘附状态，防止由于焊丝的供给故障而发生焊接不良，并且当前端部 的焊丝不能达到加工区域。 该光学处理装置包括用于产生光能的光能输出装置，用于将光能引导到工件中的第一光路，设置在用于成形光能的第一光路中的光学装置，第二光路共享第一 用于将光从工件引导到光接收装置的光路，以及用于改变至少光学装置和工件的相对位置的驱动装置。
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公开(公告)号：US07532749B2
公开(公告)日：2009-05-12
申请号：US10986893
申请日：2004-11-15
申请人： Mamoru Watanabe , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Masahiro Sato , Manabu Nishihara , Kenji Takahashi , Shinsuke Shimabayashi
发明人： Mamoru Watanabe , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Masahiro Sato , Manabu Nishihara , Kenji Takahashi , Shinsuke Shimabayashi
IPC分类号： G06K9/00
CPC分类号： B23K26/032 , B23K1/0056 , B23K26/03 , B23K26/382 , B23K26/40 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50
摘要： Provided is a light processing apparatus which can judge goodness or badness of small amount and various kind processing, and is useful for small amount and various kind processing, and can realize light processing at an appropriate position in conformity with a state of a substrate, at low cost, and can prevent production of a bad item before it happens, and enables local heating by focusing light energy, and is useful for a processing apparatus such as solder joint or heat processing of resin and a production equipment which used this. A state of an object to be processed enters into an image receiving unit, through a first light path and a second light path. This image and an image which was set up in a storage device in advance are compared, and goodness or badness judgment is carried out. There occurs a change of a point to be irradiated, in an approximately horizontal direction to the first light path, between a case that the object to be processed is in a warp age state, and a case that it is not so. The change is read as a change of an image shooting position of reflected light by the image receiving unit. It is possible to realize error stop of processing, by a level of a change amount, and to prevent processing bad item production before it happens.
摘要翻译： 本发明提供一种能够判断少量和不同种类处理的良好或不良的光处理装置，对于少量和各种处理是有用的，并且可以在与基板的状态相适应的适当位置处实现光处理 低成本，可以防止在发生之前产生不良物品，并且通过聚焦光能实现局部加热，并且可用于诸如焊接接头或树脂的热处理的加工设备以及使用它的生产设备。 待处理对象的状态通过第一光路和第二光路进入图像接收单元。 将该图像和预先设置在存储装置中的图像进行比较，并进行良好或不良判断。 在待处理物体处于翘曲状态的情况下，在与第一光路大致水平的方向上发生要照射的点的变化和不那样的情况。 该改变被读取为由图像接收单元改变反射光的图像拍摄位置。 可以通过改变量的水平来实现处理的错误停止，并且防止在发生之前处理不良的产品。
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公开(公告)号：US20050103753A1
公开(公告)日：2005-05-19
申请号：US10986893
申请日：2004-11-15
申请人： Mamoru Watanabe , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Manabu Nishihara , Kenji Takahashi , Shinsuke Shimabayashi
发明人： Mamoru Watanabe , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Manabu Nishihara , Kenji Takahashi , Shinsuke Shimabayashi
CPC分类号： B23K26/032 , B23K1/0056 , B23K26/03 , B23K26/382 , B23K26/40 , B23K2101/42 , B23K2103/16 , B23K2103/42 , B23K2103/50
摘要： Provided is a light processing apparatus which can judge goodness or badness of small amount and various kind processing, and is useful for small amount and various kind processing, and can realize light processing at an appropriate position in conformity with a state of a substrate, at low cost, and can prevent production of a bad item before it happens, and enables local heating by focusing light energy, and is useful for a processing apparatus such as solder joint or heat processing of resin and a production equipment which used this. A state of an object to be processed enters into an image receiving unit, through a first light path and a second light path. This image and an image which was set up in a storage device in advance are compared, and goodness or badness judgment is carried out. There occurs a change of a point to be irradiated, in an approximately horizontal direction to the first light path, between a case that the object to be processed is in a warpage state, and a case that it is not so. The change is read as a change of an image shooting position of reflected light by the image receiving unit. It is possible to realize error stop of processing, by a level of a change amount, and to prevent processing bad item production before it happens.
摘要翻译： 本发明提供一种能够判断少量，不同种类处理的良好或不良的光处理装置，对于少量和各种处理是有用的，并且可以在与基板的状态相适应的适当位置处实现光处理 低成本，可以防止在发生之前产生不良物品，并且通过聚焦光能实现局部加热，并且可用于诸如焊接接头或树脂的热处理的加工设备以及使用它的生产设备。 待处理对象的状态通过第一光路和第二光路进入图像接收单元。 将该图像和预先设置在存储装置中的图像进行比较，并进行良好或不良判断。 在待处理对象处于翘曲状态的情况下，在与第一光路大致水平的方向上发生要照射的点的变化和不那样的情况。 该改变被读取为由图像接收单元改变反射光的图像拍摄位置。 可以通过改变量的水平来实现处理的错误停止，并且防止在发生之前处理不良的产品。
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