发明授权
- 专利标题： Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
- 专利标题（中）： 用碳纳米管阵列封装集成电路，以通过热界面增强散热
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申请号： US11313362申请日： 2005-12-20
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公开(公告)号： US07847394B2公开(公告)日： 2010-12-07
- 发明人: Valery M Dubin , Thomas S. Dory
- 申请人： Valery M Dubin , Thomas S. Dory
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34
摘要：
According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed thereon. Then, a porous layer is formed on the metal layer. A barrier layer of the porous layer at the bottom of the pores is thinned down. Then, a catalyst is deposited at the bottom of the pores. Carbon nanotubes are then grown in the pores. Another layer of metal is then formed over the porous layer and the carbon nanotubes. The semiconductor wafer is then separated into microelectronic dies. The dies are bonded to a semiconductor substrate, a heat spreader is placed on top of the die, and a semiconductor package resulting from such assembly is sealed. A thermal interface is formed on the top of the heat spreader. Then a heat sink is placed on top of the thermal interface.
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