发明授权
- 专利标题： Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
- 专利标题（中）： 半导体元件包括具有外部连接条的半导体芯片和半导体元件载体
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申请号： US11619350申请日： 2007-01-03
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公开(公告)号： US07851927B2公开(公告)日： 2010-12-14
- 发明人: Khalil Hosseini , Alexander Koenigsberger , Ralf Otremba , Klaus Schiess
- 申请人： Khalil Hosseini , Alexander Koenigsberger , Ralf Otremba , Klaus Schiess
- 申请人地址： DE
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE
- 代理机构： Banner & Witcoff, Ltd.
- 优先权： DE102006060484 20061219
- 主分类号： H01L21/28
- IPC分类号： H01L21/28
摘要：
A semiconductor component (1) has a semiconductor chip (5) and a semiconductor component carrier (3) with external connection strips (12, 13, 15). The semiconductor chip (5) has a first electrode (6) and a control electrode (7) on its top side (8) and a second electrode (9) on its rear side (10). The semiconductor chip (5) is fixed by its top side (8) in flip-chip arrangement (11) on a first and a second external connection strip (12, 13) for the first electrode (6) and the control electrode (7). The second electrode (9) is electrically connected to at least one third external connection strip (15) via a bonding tape (14).
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