Invention Grant
US07855130B2 Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations
有权
用于防止晶圆切片操作期间半导体器件接合焊盘腐蚀的防腐蚀添加剂
- Patent Title: Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations
- Patent Title (中): 用于防止晶圆切片操作期间半导体器件接合焊盘腐蚀的防腐蚀添加剂
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Application No.: US10249576Application Date: 2003-04-21
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Publication No.: US07855130B2Publication Date: 2010-12-21
- Inventor: Robert R Cadieux , Scott A Estes , Timothy C Krywanczyk
- Applicant: Robert R Cadieux , Scott A Estes , Timothy C Krywanczyk
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Richard M. Kotulak
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/46
Abstract:
An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.
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Information query
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