发明授权
- 专利标题： Multilayer printed circuit board using paste bumps
- 专利标题（中）： 多层印刷电路板使用焊膏
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申请号： US12588165申请日： 2009-10-06
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公开(公告)号： US07859106B2公开(公告)日： 2010-12-28
- 发明人: Yoong Oh , Chang-Sup Ryu , Dong-Jin Park , Jee-Soo Mok , Byung-Bae Seo
- 申请人： Yoong Oh , Chang-Sup Ryu , Dong-Jin Park , Jee-Soo Mok , Byung-Bae Seo
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2005-0114696 20051129
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.
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