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    Printed circuit board using paste bump and manufacturing method thereof
    1.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20080283288A1

    公开(公告)日：2008-11-20

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Printed circuit board using paste bump and manufacturing method thereof
    2.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 审中-公开
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20070107934A1

    公开(公告)日：2007-05-17

    申请号：US11598140

    申请日：2006-11-13

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11 ,  H01R12/04

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a printed circuit board using paste bumps, comprising: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 利用使用糊状凸块的印刷电路板的制造方法，其特征在于，包括：（a）对芯板进行穿孔以形成至少一个通孔，（b）通过填充电镀填充所述至少一个通孔并形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路， 可以通过增加镀层芯板的BVH的强度来实现层IVH结构，由于并行处理和集体堆叠，可以减少制造时间，由于粘贴凸块的铜箔可实现微电路 堆叠在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且凹坑覆盖可以 获得。

    Printed circuit board using paste bump and manufacturing method thereof
    3.
    发明授权
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US07973248B2

    公开(公告)日：2011-07-05

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于粘贴凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Method for fabricating core substrate using paste bumps
    6.
    发明授权
    Method for fabricating core substrate using paste bumps 失效
    使用糊状凸块制造芯基板的方法

    公开(公告)号：US07622329B2

    公开(公告)日：2009-11-24

    申请号：US11602332

    申请日：2006-11-21

    申请人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

    发明人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

    IPC分类号： H01L21/00 ,  H01L23/48

    CPC分类号： H01L21/486 ,  H01L21/4867 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/1572 ,  H01L2924/00

    摘要： A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps comprising: (a) aligning a pair of paste bump boards, each of which has a plurality of paste bumps joined to its surface, such that the paste bumps face each other, and (b) pressing the pair of paste bump boards together, where an insulation element is placed between the pair of paste bump boards, it is easier to implement interlayer electrical interconnection between circuit patterns, the thickness of the core substrate can readily be adjusted by adjusting the thickness of the insulation layer, the stiffness is improved as a pair of paste bump boards are pressed from the top and bottom, and high-density wiring can be formed more easily as the paste bumps are connected in pairs so that the diameters of the paste bumps formed on the paste bump boards can be reduced.

    摘要翻译： 公开了一种使用糊状凸块的芯基板和多层印刷电路板及其制造方法。 利用使用糊状凸块的芯基板的制造方法，其特征在于，包括：（a）对准一对粘贴凸块，其中，每一个均具有与其表面接合的多个焊料凸块，使得所述焊膏凸起彼此面对;以及（b ）将一对焊膏凸块按压在一起，其中绝缘元件放置在一对焊膏凸块之间，更容易实现电路图案之间的层间电互连，通过调节厚度可以容易地调节芯基板的厚度 的绝缘层，由于从顶部和底部按压一对糊状凸块，刚度得以改善，并且随着糊料凸块成对连接，可以更容易地形成高密度布线，使得糊料凸块的直径 可以减少形成在糊状凸块上。

    Core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof
    8.
    发明申请
    Core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof 失效
    使用糊状凸块的芯基板和多层印刷电路板及其制造方法

    公开(公告)号：US20070120253A1

    公开(公告)日：2007-05-31

    申请号：US11602332

    申请日：2006-11-21

    申请人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

    发明人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

    IPC分类号： H01L23/48

    CPC分类号： H01L21/486 ,  H01L21/4867 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/1572 ,  H01L2924/00

    摘要： A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps comprising: (a) aligning a pair of paste bump boards, each of which has a plurality of paste bumps joined to its surface, such that the paste bumps face each other, and (b) pressing the pair of paste bump boards together, where an insulation element is placed between the pair of paste bump boards, it is easier to implement interlayer electrical interconnection between circuit patterns, the thickness of the core substrate can readily be adjusted by adjusting the thickness of the insulation layer, the stiffness is improved as a pair of paste bump boards are pressed from the top and bottom, and high-density wiring can be formed more easily as the paste bumps are connected in pairs so that the diameters of the paste bumps formed on the paste bump boards can be reduced.

    摘要翻译： 公开了一种使用糊状凸块的芯基板和多层印刷电路板及其制造方法。 利用使用糊状凸块的芯基板的制造方法，其特征在于，包括：（a）对准一对粘贴凸块，其中，每一个均具有与其表面接合的多个焊料凸块，使得所述焊膏凸起彼此面对;以及（b ）将一对焊膏凸块按压在一起，其中绝缘元件放置在一对焊膏凸块之间，更容易实现电路图案之间的层间电互连，通过调节厚度可以容易地调节芯基板的厚度 的绝缘层，由于从顶部和底部按压一对糊状凸块，刚度得以改善，并且随着糊料凸块成对连接，可以更容易地形成高密度布线，使得糊料凸块的直径 可以减少形成在糊状凸块上。