发明授权
- 专利标题: Multilayer silicon over insulator device
- 专利标题(中): 多层硅绝缘体器件
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申请号: US11961356申请日: 2007-12-20
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公开(公告)号: US07863117B2公开(公告)日: 2011-01-04
- 发明人: Mahmoud A. Mousa , Christopher S. Putnam
- 申请人: Mahmoud A. Mousa , Christopher S. Putnam
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Richard Kotulak
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/84 ; H01L21/338 ; H01L21/337 ; H01L21/336 ; H01L21/8234 ; H01L21/76
摘要:
An apparatus and method for a multilayer silicon over insulator (SOI) device is provided. In the multilayer SOI device, the crystal orientation of at least one active region of a device is different than the active region of at least another device. Where the multilayer SOI device has a first layer including a PMOS device with a silicon active region having a crystal orientation of [100], the second layer may be an NMOS device with a active region having a silicon layer having a crystal orientation of [110]. The second layer is bonded to the first layer. The method and apparatus can be extended to more than two layers thus forming a multilayer SOI device having a different crystal orientation at each layer. The multiple layer SOI device may form circuits of reduced surface area.
公开/授权文献
- US20080108185A1 MULTILAYER SILICON OVER INSULATOR DEVICE 公开/授权日:2008-05-08
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