Invention Grant
- Patent Title: Disposable built-in self-test devices, systems and methods for testing three dimensional integrated circuits
- Patent Title (中): 一次性内置自检装置，三维集成电路测试系统和方法
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Application No.: US11939145Application Date: 2007-11-13
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Publication No.: US07863918B2Publication Date: 2011-01-04
- Inventor: Keith A. Jenkins , Seongwon Kim
- Applicant: Keith A. Jenkins , Seongwon Kim
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Anne V. Dougherty, Esq.
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A device and method for self-testing an integrated circuit layer for a three-dimensional integrated circuit includes integrally forming a disposable self-test circuit on a common substrate with a first circuit to be tested. The first circuit forms a layer in a three-dimensional integrated circuit structure. The first circuit is tested using circuitry of the self-test circuit. The self-test circuit is removed by detaching the self-test circuit from the first circuit.
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