- 专利标题: Apparatus and method for attaching substrates
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申请号: US11866877申请日: 2007-10-03
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公开(公告)号: US07864289B2公开(公告)日: 2011-01-04
- 发明人: Jae Seok Hwang , Kyung Mi Kim
- 申请人: Jae Seok Hwang , Kyung Mi Kim
- 申请人地址: KR
- 专利权人: ADP Engineering Co., Ltd.
- 当前专利权人: ADP Engineering Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: KED & Associates, LLP
- 优先权: KR10-2006-0125002 20061208
- 主分类号: G02F1/1339
- IPC分类号: G02F1/1339 ; B23K37/00
摘要:
An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
公开/授权文献
- US20080135127A1 APPARATUS AND METHOD FOR ATTACHING SUBSTRATES 公开/授权日:2008-06-12
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