发明授权
- 专利标题： Method of making circuitized substrate with a resistor
- 专利标题（中）： 用电阻制作电路化基板的方法
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申请号： US11797236申请日： 2007-05-02
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公开(公告)号： US07870664B2公开(公告)日： 2011-01-18
- 发明人: Rabindra N. Das , John M. Lauffer , Vova R. Markovich
- 申请人： Rabindra N. Das , John M. Lauffer , Vova R. Markovich
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： H05K3/30
- IPC分类号： H05K3/30
摘要：
A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
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