Invention Grant
- Patent Title: Micromechanical system including a suspension and an electrode positioned movably
- Patent Title (中): 微机械系统包括悬架和可移动的电极
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Application No.: US12323653Application Date: 2008-11-26
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Publication No.: US07878061B2Publication Date: 2011-02-01
- Inventor: Johannes Classen , Arnd Kaelberer , Patrick Wellner , Dietrich Schubert , Lars Tebje
- Applicant: Johannes Classen , Arnd Kaelberer , Patrick Wellner , Dietrich Schubert , Lars Tebje
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007060878 20071218
- Main IPC: H01L21/76
- IPC: H01L21/76
Abstract:
A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode.
Public/Granted literature
- US20090152654A1 MICROMECHANICAL SYSTEM Public/Granted day:2009-06-18
Information query
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