发明授权
US07878883B2 Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
失效
线锯锭切割系统和方法，其具有锭预热，幅材预热，浆料温度控制和/或浆料流速控制
- 专利标题： Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
- 专利标题（中）： 线锯锭切割系统和方法，其具有锭预热，幅材预热，浆料温度控制和/或浆料流速控制
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申请号： US11621920申请日： 2007-01-10
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公开(公告)号： US07878883B2公开(公告)日： 2011-02-01
- 发明人: Puneet Gupta , Milind S. Kulkarni , Carlo Zavattari , Roland R. Vandamme
- 申请人： Puneet Gupta , Milind S. Kulkarni , Carlo Zavattari , Roland R. Vandamme
- 申请人地址： US MO St. Peters
- 专利权人： MEMC Electronics Materials, Inc.
- 当前专利权人： MEMC Electronics Materials, Inc.
- 当前专利权人地址： US MO St. Peters
- 代理机构： Armstrong Teasdale LLP
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; B28D1/08
摘要：
A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.