Invention Grant
- Patent Title: Substrate processing including a masking layer
- Patent Title (中): 衬底处理包括掩模层
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Application No.: US11647882Application Date: 2006-12-29
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Publication No.: US07879710B2Publication Date: 2011-02-01
- Inventor: Zachary Fresco , Chi-I Lang , Sandra G. Malhotra , Tony P. Chiang , Thomas R. Boussie , Nitin Kumar , Jinhong Tong , Anh Duong
- Applicant: Zachary Fresco , Chi-I Lang , Sandra G. Malhotra , Tony P. Chiang , Thomas R. Boussie , Nitin Kumar , Jinhong Tong , Anh Duong
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove an effect of variations in the material layer as a result of substrate processing. The methods include normalizing the surface characteristics of the material layer by selectively depositing the MML on the material layer.
Public/Granted literature
- US20070166989A1 Substrate processing including a masking layer Public/Granted day:2007-07-19
Information query
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