Invention Grant
US07880296B2 Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon
有权
具有嵌入其中的半导体芯片和形成在其上的金属层的芯片载体结构
- Patent Title: Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon
- Patent Title (中): 具有嵌入其中的半导体芯片和形成在其上的金属层的芯片载体结构
-
Application No.: US12044271Application Date: 2008-03-07
-
Publication No.: US07880296B2Publication Date: 2011-02-01
- Inventor: Lin-Yin Wong , Zao-Kuo Lai
- Applicant: Lin-Yin Wong , Zao-Kuo Lai
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Schmeiser, Olsen & Watts LLP
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/053
Abstract:
The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal layer formed by electroplating on the bottom surface and side surfaces of the chip-embedded carrier structure. The metal layer prevents moisture from crossing the side surfaces of the chip-embedded carrier structure, so as to prevent delamination, provide a shielding effect, and improve heat dissipation through the metal layer.
Public/Granted literature
- US20080217762A1 CHIP CARRIER STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN AND METAL LAYER FORMED THEREON Public/Granted day:2008-09-11
Information query
IPC分类:
