发明授权
US07880297B2 Semiconductor chip having conductive member for reducing localized voltage drop
有权
具有用于降低局部电压降的导电部件的半导体芯片
- 专利标题： Semiconductor chip having conductive member for reducing localized voltage drop
- 专利标题（中）： 具有用于降低局部电压降的导电部件的半导体芯片
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申请号： US12116969申请日： 2008-05-08
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公开(公告)号： US07880297B2公开(公告)日： 2011-02-01
- 发明人: Che-Yuan Jao , Sheng-Ming Chang , Ching-Chih Li
- 申请人： Che-Yuan Jao , Sheng-Ming Chang , Ching-Chih Li
- 申请人地址： TW Science-Based Industrial Park, Hsin-Chu
- 专利权人： Mediatek Inc.
- 当前专利权人： Mediatek Inc.
- 当前专利权人地址： TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/06 ; H01L23/10 ; H01L23/40 ; H01L23/48 ; H01L23/52
摘要：
A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces are formed in a level of the metal interconnection; a passivation layer disposed over the two metal traces, wherein two openings are formed in the passivation layer to expose portions of the two metal traces; a conductive member externally mounted on the passivation layer between the two openings; and a redistribution layer formed over the conductive member.
公开/授权文献
- US20090166849A1 SEMICONDUCTOR CHIP 公开/授权日：2009-07-02
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