发明授权
- 专利标题： Component mounting head
- 专利标题（中）： 组件安装头
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申请号： US10582779申请日： 2004-12-15
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公开(公告)号： US07886427B2公开(公告)日： 2011-02-15
- 发明人: Hideki Uchida , Risa Sakurai , Shin-ichiro Endo , Kazuo Kido
- 申请人： Hideki Uchida , Risa Sakurai , Shin-ichiro Endo , Kazuo Kido
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Penack, L.L.P.
- 优先权： JP2003-422209 20031219
- 国际申请： PCT/JP2004/018705 WO 20041215
- 国际公布： WO2005/061188 WO 20050707
- 主分类号： H05K13/04
- IPC分类号： H05K13/04
摘要：
A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, detrimental effects due to static electricity on the suction nozzle as well as detrimental effects due to electrical conduction between the suction nozzle and the component can be prevented from occurring.
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