Invention Grant
- Patent Title: Component mounting head
- Patent Title (中): 组件安装头
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Application No.: US10582779Application Date: 2004-12-15
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Publication No.: US07886427B2Publication Date: 2011-02-15
- Inventor: Hideki Uchida , Risa Sakurai , Shin-ichiro Endo , Kazuo Kido
- Applicant: Hideki Uchida , Risa Sakurai , Shin-ichiro Endo , Kazuo Kido
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Penack, L.L.P.
- Priority: JP2003-422209 20031219
- International Application: PCT/JP2004/018705 WO 20041215
- International Announcement: WO2005/061188 WO 20050707
- Main IPC: H05K13/04
- IPC: H05K13/04
Abstract:
A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, detrimental effects due to static electricity on the suction nozzle as well as detrimental effects due to electrical conduction between the suction nozzle and the component can be prevented from occurring.
Public/Granted literature
- US20070289125A1 Component Mounting Head, Suction Nozzle, and Suction Nozzle Manufacturing Method Public/Granted day:2007-12-20
Information query
