发明授权
- 专利标题： Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same
- 专利标题（中）： 用于抛光铝膜的抛光浆料和使用其抛光铝膜的抛光方法
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申请号： US11602503申请日： 2006-11-21
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公开(公告)号： US07887609B2公开(公告)日： 2011-02-15
- 发明人: Hiroshi Ono , Toranosuke Ashizawa , Yasuo Kamigata
- 申请人： Hiroshi Ono , Toranosuke Ashizawa , Yasuo Kamigata
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JPP2005-336938 20051122; JPP2006-260709 20060926
- 主分类号： B24D3/02
- IPC分类号： B24D3/02 ; C09C1/68 ; C09K3/14 ; B24B1/00 ; B24B9/00 ; C09G1/02
摘要：
A polishing slurry for polishing an aluminum film used for LSI or the like and a method for polishing an aluminum film using the same are provided. A polishing slurry for polishing an aluminum film comprising a polyvalent carboxylic acid having a first stage acid dissociation exponent at 25° C. of 3 or lower, colloidal silica, and water, and having a pH from 2 to 4, and a polishing method for polishing an aluminum film using the polishing slurry.
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