发明授权
- 专利标题: Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
- 专利标题(中): 电铸模具及其制造方法以及电铸部件的制造方法
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申请号: US11326149申请日: 2006-01-05
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公开(公告)号: US07887995B2公开(公告)日: 2011-02-15
- 发明人: Takashi Niwa , Susumu Ichihara , Koichiro Jujo , Hiroyuki Hoshina
- 申请人: Takashi Niwa , Susumu Ichihara , Koichiro Jujo , Hiroyuki Hoshina
- 申请人地址: JP
- 专利权人: Seiko Instruments Inc.
- 当前专利权人: Seiko Instruments Inc.
- 当前专利权人地址: JP
- 代理机构: Adams & Wilks
- 优先权: JP2005-007052 20050114; JP2005-203983 20050713; JP2005-335328 20051121
- 主分类号: G03F7/00
- IPC分类号: G03F7/00
摘要:
An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.
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