发明授权
US07887995B2 Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
电铸模具及其制造方法以及电铸部件的制造方法

Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
摘要:
An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.
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