Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    1.
    发明授权
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US08021534B2

    公开(公告)日:2011-09-20

    申请号:US12657150

    申请日:2010-01-14

    IPC分类号: C25D1/00 G03F7/20

    CPC分类号: C25D5/022 C25D1/10

    摘要: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.

    摘要翻译: 为了提供一种用于制造多步结构微小部件的电铸模具及其制造方法,其高度控制是可能的,并且制造工艺不会变得复杂。 在形成在基板1的上表面上的导电层2的膜的上表面上,形成有形成第一可溶部分3b和第一不溶部分3a的抗蚀剂3。 接下来,在抗蚀剂的上表面上形成光吸收体10,进行曝光和显影,此外,在其上表面上形成有导电层2的膜,以及光吸收体10和 在吸光体10的上表面上的导电层5通过剥离除去。 此外,在其上表面上形成有抗蚀剂,其中形成有第二可溶部分6b和第二不溶部分6a。 接下来,将第一抗蚀剂和第二抗蚀剂显影以除去第一可溶部分3b和第二可溶部分6b,从而在各步骤的基部上形成具有导电层的电铸模具101。

    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    2.
    发明申请
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US20100116670A1

    公开(公告)日:2010-05-13

    申请号:US12657150

    申请日:2010-01-14

    IPC分类号: C25D1/00 G03F7/20

    CPC分类号: C25D5/022 C25D1/10

    摘要: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.

    摘要翻译: 为了提供一种用于制造多步结构微小部件的电铸模具及其制造方法,其高度控制是可能的,并且制造工艺不会变得复杂。 在形成在基板1的上表面上的导电层2的膜的上表面上,形成有形成第一可溶部分3b和第一不溶部分3a的抗蚀剂3。 接下来,在抗蚀剂的上表面上形成光吸收体10,进行曝光和显影,此外,在其上表面上形成有导电层2的膜,以及光吸收体10和 在吸光体10的上表面上的导电层5通过剥离除去。 此外,在其上表面上形成有抗蚀剂,其中形成有第二可溶部分6b和第二不溶部分6a。 接下来,将第一抗蚀剂和第二抗蚀剂显影以除去第一可溶部分3b和第二可溶部分6b,从而在各步骤的基部上形成具有导电层的电铸模具101。

    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    3.
    发明授权
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US07887995B2

    公开(公告)日:2011-02-15

    申请号:US11326149

    申请日:2006-01-05

    IPC分类号: G03F7/00

    CPC分类号: C25D5/022 C25D1/10

    摘要: An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.

    摘要翻译: 电铸模具具有形成在导电基体上的第一负型感光材料,第一通孔延伸穿过第一感光材料以露出导电基片。 形成在第一感光材料的上表面上的导电层包围第一通孔。 形成在导电层的上表面上的第二负型感光材料具有覆盖并暴露包围第一通孔的导电层的第一通孔和周边部分的第二通孔。 因为导电基片和导电层彼此分开,所以第一和第二通孔在电铸模使用期间独立地沉淀电铸物体,从而形成均匀的电铸物体。

    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    4.
    发明申请
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US20060160027A1

    公开(公告)日:2006-07-20

    申请号:US11326149

    申请日:2006-01-05

    IPC分类号: G03F7/00

    CPC分类号: C25D5/022 C25D1/10

    摘要: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.

    摘要翻译: 为了提供一种用于制造多步结构微小部件的电铸模具及其制造方法,其高度控制是可能的,并且制造工艺不会变得复杂。 在形成在基板1的上表面上的导电层2的膜的上表面上形成抗蚀剂3,其中形成有第一可溶部分3b和第一不溶部分3a。 接下来,在抗蚀剂的上表面上形成光吸收体10,进行曝光和显影,此外,在其上表面上形成有导电层2的膜,以及光吸收体10和 在吸光体10的上表面上的导电层5通过剥离除去。 此外,在其上表面上形成有抗蚀剂,其中形成有第二可溶部分6b和第二不溶部分6a。 接下来,将第一抗蚀剂和第二抗蚀剂显影以除去第一可溶部分3b和第二可溶部分6b,从而在各步骤的基底部分上形成具有导电层的电铸模具101。

    METHOD FOR MANUFACTURING ELECTROFORMED MOLD, ELECTROFORMED MOLD, AND METHOD FOR MANUFACTURING ELECTROFORMED PARTS
    5.
    发明申请
    METHOD FOR MANUFACTURING ELECTROFORMED MOLD, ELECTROFORMED MOLD, AND METHOD FOR MANUFACTURING ELECTROFORMED PARTS 有权
    制造电铸模具的方法,电铸模具及制造电气部件的方法

    公开(公告)号:US20100288643A1

    公开(公告)日:2010-11-18

    申请号:US12376629

    申请日:2007-07-10

    IPC分类号: C25D1/00 G03F7/20 C25D1/10

    CPC分类号: G03F7/0035 C25D1/10 C25D5/022

    摘要: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

    摘要翻译: 在制造电铸模的方法中,在基板的底部导电膜的上表面上形成第一光致抗蚀剂层,并且将第一光致抗蚀剂层分成第一可溶部分和第一不溶部分。 导电材料在预定温度范围内热沉积在第一光致抗蚀剂层的上表面上,从而形成中间导电膜。 对中间导电膜进行图案化。 在除去中间导电膜之后,在图案化之后残留的中间导电膜的上表面上,在第一光致抗蚀剂层的暴露的上表面上形成第二光致抗蚀剂层。 第二光致抗蚀剂层被分成第二可溶部分和第二不溶部分。 接下来,使第一和第二光致抗蚀剂层被显影,并且去除第一和第二可溶部分。

    Method of manufacturing electroforming mold, electroforming mold, and method of manufacturing electroformed component
    6.
    发明授权
    Method of manufacturing electroforming mold, electroforming mold, and method of manufacturing electroformed component 有权
    电铸模具的制造方法,电铸模具以及电铸部件的制造方法

    公开(公告)号:US08518632B2

    公开(公告)日:2013-08-27

    申请号:US12376629

    申请日:2007-07-10

    IPC分类号: G03F7/00

    CPC分类号: G03F7/0035 C25D1/10 C25D5/022

    摘要: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

    摘要翻译: 在电铸模具的制造方法中,在基板的底部导电膜的上表面上形成第一光致抗蚀剂层,将第一光致抗蚀剂层分割为第一可溶部分和第一不溶部分。 导电材料在预定温度范围内热沉积在第一光致抗蚀剂层的上表面上,从而形成中间导电膜。 对中间导电膜进行图案化。 在除去中间导电膜之后,在图案化之后残留的中间导电膜的上表面上,在第一光致抗蚀剂层的暴露的上表面上形成第二光致抗蚀剂层。 第二光致抗蚀剂层被分成第二可溶部分和第二不溶部分。 接下来,使第一和第二光致抗蚀剂层被显影,并且去除第一和第二可溶部分。

    Method of manufacturing a mirror and a mirror device
    8.
    发明申请
    Method of manufacturing a mirror and a mirror device 审中-公开
    制造镜子和镜面装置的方法

    公开(公告)号:US20070177287A1

    公开(公告)日:2007-08-02

    申请号:US11729754

    申请日:2007-03-28

    CPC分类号: B81C1/00619 B81B2201/042

    摘要: A method of manufacturing a mirror having high verticality and less surface roughness, comprising forming a mask material to the surface of a silicon substrate, applying anisotropic dry etching and anisotropic wet etching, thereby anisotropically dry etching the surface substantially parallel with the crystal face in perpendicular to the surface of the substrate and then forming a reflection surface by the anisotropic wet etching step.

    摘要翻译: 一种制造具有高垂直度和较小表面粗糙度的反射镜的方法,包括在硅衬底的表面上形成掩模材料,施加各向异性干法蚀刻和各向异性湿蚀刻,从而各向异性地将垂直于晶体面平行的表面垂直刻蚀 到基板的表面,然后通过各向异性湿蚀刻步骤形成反射表面。