Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    1.
    发明申请
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US20100116670A1

    公开(公告)日:2010-05-13

    申请号:US12657150

    申请日:2010-01-14

    IPC分类号: C25D1/00 G03F7/20

    CPC分类号: C25D5/022 C25D1/10

    摘要: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.

    摘要翻译: 为了提供一种用于制造多步结构微小部件的电铸模具及其制造方法,其高度控制是可能的,并且制造工艺不会变得复杂。 在形成在基板1的上表面上的导电层2的膜的上表面上,形成有形成第一可溶部分3b和第一不溶部分3a的抗蚀剂3。 接下来,在抗蚀剂的上表面上形成光吸收体10,进行曝光和显影,此外,在其上表面上形成有导电层2的膜,以及光吸收体10和 在吸光体10的上表面上的导电层5通过剥离除去。 此外,在其上表面上形成有抗蚀剂,其中形成有第二可溶部分6b和第二不溶部分6a。 接下来,将第一抗蚀剂和第二抗蚀剂显影以除去第一可溶部分3b和第二可溶部分6b,从而在各步骤的基部上形成具有导电层的电铸模具101。

    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    2.
    发明授权
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US08021534B2

    公开(公告)日:2011-09-20

    申请号:US12657150

    申请日:2010-01-14

    IPC分类号: C25D1/00 G03F7/20

    CPC分类号: C25D5/022 C25D1/10

    摘要: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.

    摘要翻译: 为了提供一种用于制造多步结构微小部件的电铸模具及其制造方法,其高度控制是可能的,并且制造工艺不会变得复杂。 在形成在基板1的上表面上的导电层2的膜的上表面上,形成有形成第一可溶部分3b和第一不溶部分3a的抗蚀剂3。 接下来,在抗蚀剂的上表面上形成光吸收体10,进行曝光和显影,此外,在其上表面上形成有导电层2的膜,以及光吸收体10和 在吸光体10的上表面上的导电层5通过剥离除去。 此外,在其上表面上形成有抗蚀剂,其中形成有第二可溶部分6b和第二不溶部分6a。 接下来,将第一抗蚀剂和第二抗蚀剂显影以除去第一可溶部分3b和第二可溶部分6b,从而在各步骤的基部上形成具有导电层的电铸模具101。

    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    3.
    发明授权
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US07887995B2

    公开(公告)日:2011-02-15

    申请号:US11326149

    申请日:2006-01-05

    IPC分类号: G03F7/00

    CPC分类号: C25D5/022 C25D1/10

    摘要: An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.

    摘要翻译: 电铸模具具有形成在导电基体上的第一负型感光材料,第一通孔延伸穿过第一感光材料以露出导电基片。 形成在第一感光材料的上表面上的导电层包围第一通孔。 形成在导电层的上表面上的第二负型感光材料具有覆盖并暴露包围第一通孔的导电层的第一通孔和周边部分的第二通孔。 因为导电基片和导电层彼此分开,所以第一和第二通孔在电铸模使用期间独立地沉淀电铸物体,从而形成均匀的电铸物体。

    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component
    4.
    发明申请
    Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component 有权
    电铸模具及其制造方法以及电铸部件的制造方法

    公开(公告)号:US20060160027A1

    公开(公告)日:2006-07-20

    申请号:US11326149

    申请日:2006-01-05

    IPC分类号: G03F7/00

    CPC分类号: C25D5/022 C25D1/10

    摘要: To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.

    摘要翻译: 为了提供一种用于制造多步结构微小部件的电铸模具及其制造方法,其高度控制是可能的,并且制造工艺不会变得复杂。 在形成在基板1的上表面上的导电层2的膜的上表面上形成抗蚀剂3,其中形成有第一可溶部分3b和第一不溶部分3a。 接下来,在抗蚀剂的上表面上形成光吸收体10,进行曝光和显影,此外,在其上表面上形成有导电层2的膜,以及光吸收体10和 在吸光体10的上表面上的导电层5通过剥离除去。 此外,在其上表面上形成有抗蚀剂,其中形成有第二可溶部分6b和第二不溶部分6a。 接下来,将第一抗蚀剂和第二抗蚀剂显影以除去第一可溶部分3b和第二可溶部分6b,从而在各步骤的基底部分上形成具有导电层的电铸模具101。

    Battery pack with a remaining battery power calculating function
    6.
    发明授权
    Battery pack with a remaining battery power calculating function 有权
    具有剩余电池功率计算功能的电池组

    公开(公告)号:US07095212B2

    公开(公告)日:2006-08-22

    申请号:US10815444

    申请日:2004-04-01

    IPC分类号: H02J7/00

    CPC分类号: H02J7/0031 H02J2007/005

    摘要: A battery pack has a secondary battery connected to a plus side terminal. A protective circuit protects the secondary battery from overcharge and over-discharge. A calculation circuit operates with a minus side terminal as a reference for calculating a remaining capacity of the secondary battery. An N-channel MOS transistor is connected between the secondary battery and the minus terminal for controlling charge and discharge of the secondary battery in accordance with a signal from the protective circuit. A level shifter circuit is connected between the calculation circuit and a communication terminal.

    摘要翻译: 电池组具有连接到正面端子的二次电池。 保护电路保护二次电池免于过充电和过放电。 计算电路以负侧端子为参考,以计算二次电池的剩余容量。 N沟道MOS晶体管连接在二次电池和负极之间,用于根据来自保护电路的信号控制二次电池的充放电。 电平移位电路连接在计算电路和通信终端之间。

    Optical microcantilever
    9.
    发明授权
    Optical microcantilever 失效
    光学微悬臂梁

    公开(公告)号:US07496250B2

    公开(公告)日:2009-02-24

    申请号:US11799974

    申请日:2007-05-03

    IPC分类号: G02B6/12

    CPC分类号: G01Q60/38 G01Q60/06 G01Q60/22

    摘要: An optical microcantilever for a scanning near field microscope comprises a support section, a cantilever-shaped optical waveguide, and a light blocking wall. The optical waveguide has a free end, a fixed end fixed to the support section and terminating in a light input/output end, and a tip formed at a side of the free end of the cantilever and having a microscopic aperture at an end thereof. The light blocking wall blocks the transmission of light scattered from a region of the light input/output end in the direction of the tip of the optical waveguide.

    摘要翻译: 用于扫描近场显微镜的光学微悬臂梁包括支撑部分,悬臂形光波导和遮光壁。 光波导具有自由端,固定到支撑部分并终止于光输入/输出端的固定端,以及形成在悬臂自由端一侧的尖端,并在其一端具有微小孔。 光阻挡壁阻挡从光输入/输出端的区域在光波导的尖端方向上散射的光的透射。