摘要:
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.
摘要:
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.
摘要:
An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.
摘要:
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1, a resist 3 is formed in which a first soluble portion 3b and a first insoluble portion 3a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6b and a second insoluble portion 6a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3b and the second soluble portion 6b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.
摘要:
An optical microcantilever capable of reducing loss when propagating light. An optical microcantilever 10 comprises a support 1, an optical waveguide 2, a light-blocking film 3, a reflecting film 4, a pointed tip 5, a microscopic aperture 6 formed at the end of the tip 5, and a mirror 7 for reflecting propagating light H propagated from a light input/output end 8 of the optical waveguide 2 towards the microscopic aperture 6.
摘要:
A battery pack has a secondary battery connected to a plus side terminal. A protective circuit protects the secondary battery from overcharge and over-discharge. A calculation circuit operates with a minus side terminal as a reference for calculating a remaining capacity of the secondary battery. An N-channel MOS transistor is connected between the secondary battery and the minus terminal for controlling charge and discharge of the secondary battery in accordance with a signal from the protective circuit. A level shifter circuit is connected between the calculation circuit and a communication terminal.
摘要:
A near-field optical head has a planar substrate having a first surface, a second surface disposed opposite to the first surface, and an inverted conical or pyramidal hole extending through the first and second surfaces. The conical or pyramidal hole has at least one fine aperture formed at an apex thereof and is disposed on the first surface of the planar substrate. An optical waveguide is disposed on the second surface of the planar substrate for propagating light. A light reflection film is disposed in the optical waveguide for reflecting in the direction of the fine aperture light propagated through the optical waveguide.
摘要:
An apparatus for forming an optical aperture comprises an object having a tip with a pointed end. Stoppers are disposed adjacent the tip. A pressing body applies a loading force to press the pointed end of the tip and at least a part of each of the stoppers to form an optical aperture at the pointed end of the tip. A load controller controls the loading force applied by the loader.
摘要:
An optical microcantilever for a scanning near field microscope comprises a support section, a cantilever-shaped optical waveguide, and a light blocking wall. The optical waveguide has a free end, a fixed end fixed to the support section and terminating in a light input/output end, and a tip formed at a side of the free end of the cantilever and having a microscopic aperture at an end thereof. The light blocking wall blocks the transmission of light scattered from a region of the light input/output end in the direction of the tip of the optical waveguide.
摘要:
An optical aperture is fabricated by providing a pressing body and object having a substrate, at least one conical- or pyramidal-shaped tip disposed on the substrate, at least one stopper disposed on the substrate at a vicinity of the tip, and an optical shielding film disposed on at least a portion of each of the stopper and the tip. A surface of the pressing body is then disposed in confronting relation to the object. The pressing body is then displaced to bring the surface of the pressing body in contact with the object so that a force component is directed to a front end of the tip to form an optical aperture at the front end of the tip.