Invention Grant
- Patent Title: Surface flaw detection system to facilitate nondestructive inspection of a component and methods of assembling the same
- Patent Title (中): 表面缺陷检测系统，方便组件的非破坏性检查及组装方法
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Application No.: US11935118Application Date: 2007-11-05
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Publication No.: US07888932B2Publication Date: 2011-02-15
- Inventor: William Stewart McKnight , Ui Suh , Yuri Plotnikov , Changting Wang , Ralph Gerald Isaacs
- Applicant: William Stewart McKnight , Ui Suh , Yuri Plotnikov , Changting Wang , Ralph Gerald Isaacs
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Armstrong Teasdale LLP
- Agent William Scott Andes, Esq.
- Main IPC: G01N27/82
- IPC: G01N27/82
Abstract:
A method of assembling an eddy current array probe to facilitate nondestructive testing of a sample is provided. The method includes positioning a plurality of differential side mount coils at least partially within a flexible material. The method also includes coupling the flexible material within a tip portion of the eddy current array probe, such that the flexible material has a contour that substantially conforms to a portion of a surface of the sample to be tested.
Public/Granted literature
- US20090115410A1 EDDY CURRENT PROBE AND METHODS OF ASSEMBLING THE SAME Public/Granted day:2009-05-07
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