发明授权
- 专利标题： Wafer electrical discharge control using argon free dechucking gas
- 专利标题（中）： 使用无氩脱胶气体进行晶圆放电控制
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申请号： US11853968申请日： 2007-09-12
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公开(公告)号： US07892445B1公开(公告)日： 2011-02-22
- 发明人: David Wei , Howard Dang , Masahiro Watanabe , Sean Kang , Kenji Takeshita , Mayumi Block , Stephen Sirard , Eric Hudson
- 申请人： David Wei , Howard Dang , Masahiro Watanabe , Sean Kang , Kenji Takeshita , Mayumi Block , Stephen Sirard , Eric Hudson
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Beyer Law Group LLP
- 主分类号： B44C1/22
- IPC分类号： B44C1/22
摘要：
A method of dechucking a wafer, with a low-k dielectric layer, held onto an electrostatic chuck by an electrostatic charge in a plasma chamber is provided. The electrostatic clamping voltage is removed. An essentially argon free dechucking gas is provided into the plasma chamber. A dechucking plasma is formed from the dechucking gas in the plasma chamber. The dechucking plasma is stopped.
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