Invention Grant
- Patent Title: Stress enhanced transistor
- Patent Title (中): 应力增强晶体管
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Application No.: US12644882Application Date: 2009-12-22
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Publication No.: US07893496B2Publication Date: 2011-02-22
- Inventor: Igor Peidous , Rohit Pal
- Applicant: Igor Peidous , Rohit Pal
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
Stress enhanced MOS transistors are provided. A semiconductor device is provided that comprises a semiconductor-on-insulator structure, a gate insulator layer, a source region, a drain region and a conductive gate overlying the gate insulator layer. The semiconductor-on-insulator structure comprises: a substrate, a semiconductor layer, and an insulating layer disposed between the substrate and the semiconductor layer. The semiconductor layer has a first surface, a second surface and a first region. The gate insulator layer overlies the first region, the conductive gate overlies the gate insulator layer, and the source region and the drain region overlie the first surface and comprise a strain-inducing epitaxial layer
Public/Granted literature
- US20100096698A1 STRESS ENHANCED TRANSISTOR Public/Granted day:2010-04-22
Information query
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