发明授权
- 专利标题: Semiconductor integrated circuit device
- 专利标题(中): 半导体集成电路器件
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申请号: US12677745申请日: 2008-09-19
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公开(公告)号: US07906990B2公开(公告)日: 2011-03-15
- 发明人: Fukashi Morishita
- 申请人: Fukashi Morishita
- 申请人地址: JP Kanagawa
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2007-257068 20071001
- 国际申请: PCT/JP2008/067011 WO 20080919
- 国际公布: WO2009/044642 WO 20090409
- 主分类号: H01L25/00
- IPC分类号: H01L25/00 ; H03K19/00 ; H03K19/20
摘要:
The present invention provides a semiconductor integrated circuit device in which characteristics of an SOI transistor are effectively used to achieve higher speed, higher degree of integration, and also reduction in voltage and power consumption. The semiconductor integrated circuit device according to the present invention has a configuration in which a plurality of external power supply lines and body voltage control lines are alternately arranged in one direction so as to extend over the entire chip, which supply power and a body voltage to logic circuits, an analog circuit and memory circuits. A body voltage control type logic gate is fully applied in the logic circuit, whereas the body voltage control type logic gate is partially applied in the memory circuit.
公开/授权文献
- US20100188120A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 公开/授权日:2010-07-29
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