发明授权
- 专利标题： Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
- 专利标题（中）： 电子装置包装板，包装板制造方法，半导体模块，半导体模块制造方法和移动装置
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申请号： US11957030申请日： 2007-12-14
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公开(公告)号： US07915737B2公开(公告)日： 2011-03-29
- 发明人: Mayumi Nakasato , Yoshio Okayama , Ryosuke Usui
- 申请人： Mayumi Nakasato , Yoshio Okayama , Ryosuke Usui
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Fish & Richardson P.C.
- 优先权： JP2006-337708 20061215; JP2006-343036 20061220; JP2007-314240 20071205; JP2007-314241 20071205
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A manufacturing technology is provided capable of improving the reliability of a semiconductor module having a via contact connected to an electrode part of a semiconductor component. The semiconductor module includes: a semiconductor component provided with an electrode part on a mounting surface; an insulating layer provided on the mounting surface of the semiconductor component; a wiring layer formed on the insulating layer; a first conductor part which is embedded in the insulating layer and which is in contact with the electrode part; and a second conductor part which is formed in an aperture provided in the insulating layer above the first conductor part and which electrically connects the first conductor part and the wiring layer.
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