Methods for forming patterns

Invention Grant

US07919413B2 Methods for forming patterns 有权

Title translation: 形成图案的方法

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Patent Title: Methods for forming patterns
Patent Title (中): 形成图案的方法
Application No.: US11834579

Application Date: 2007-08-06
Publication No.: US07919413B2

Publication Date: 2011-04-05
Inventor: Frederick T Chen
Applicant: Frederick T Chen
Applicant Address: TW Hsinchu
Assignee: Industrial Technology Research Institute
Current Assignee: Industrial Technology Research Institute
Current Assignee Address: TW Hsinchu
Main IPC: H01L21/311
IPC: H01L21/311

Abstract:

A method for forming patterns comprises providing a substrate. A set of seed features is formed over the substrate. At least one bi-layer comprising a first layer followed by a second layer is formed on the set of seed features. The first layer and the second layer above the set of seed features are removed. The first layer and the second layer are anisotropically etched successively at least one time to form an opening next to the set of seed features.

Abstract(Chinese):

用于形成图案的方法包括提供基底。在衬底上形成一组种子特征。在该组种子特征上形成至少一个包含第一层和第二层的双层。去除了一组种子特征之上的第一层和第二层。第一层和第二层被连续地各向异性蚀刻至少一次，以形成一组种子特征旁边的开口。

Public/Granted literature

US20090042391A1 METHODS FOR FORMING PATTERNS Public/Granted day:2009-02-12

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3105	......后处理
H01L21/311	.......绝缘层的刻蚀