Invention Grant
- Patent Title: Reduction of substrate optical leakage in integrated photonic circuits through localized substrate removal
- Patent Title (中): 通过局部衬底去除减少集成光子电路中的衬底光学泄漏
-
Application No.: US12113580Application Date: 2008-05-01
-
Publication No.: US07920770B2Publication Date: 2011-04-05
- Inventor: Charles Holzwarth , Jason S. Orcutt , Milos Popovic , Judy L. Hoyt , Rajeev Ram
- Applicant: Charles Holzwarth , Jason S. Orcutt , Milos Popovic , Judy L. Hoyt , Rajeev Ram
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Goodwin Procter LLP
- Main IPC: G02B6/10
- IPC: G02B6/10 ; G02B6/12
Abstract:
Structures including optical waveguides disposed over substrates having a chamber or trench defined therein, and methods for formation thereof.
Public/Granted literature
Information query
