发明授权
- 专利标题： Laser machining method and laser machining apparatus
- 专利标题（中）： 激光加工方法和激光加工设备
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申请号： US11843274申请日： 2007-08-22
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公开(公告)号： US07923659B2公开(公告)日： 2011-04-12
- 发明人: Kunio Arai , Yasuhiko Kita , Yasushi Ito
- 申请人： Kunio Arai , Yasuhiko Kita , Yasushi Ito
- 申请人地址： JP Ebina-shi
- 专利权人： Hitachi Via Mechanics, Ltd.
- 当前专利权人： Hitachi Via Mechanics, Ltd.
- 当前专利权人地址： JP Ebina-shi
- 代理机构： Crowell & Moring LLP
- 优先权： JP2006-237033 20060831
- 主分类号： B23K26/06
- IPC分类号： B23K26/06 ; B23K26/073
摘要：
A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.
公开/授权文献
- US20080053974A1 Laser Machining Method and Laser Machining Apparatus 公开/授权日：2008-03-06
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