公开(公告)号：US20080053974A1

公开(公告)日：2008-03-06

申请号：US11843274

申请日：2007-08-22

申请人： Kunio Arai ,  Yasuhiko Kita ,  Yasushi Ito

发明人： Kunio Arai ,  Yasuhiko Kita ,  Yasushi Ito

IPC分类号： B23K26/06

CPC分类号： B23K26/0648 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/082 ,  B23K26/382 ,  B23K2101/42 ,  B23K2103/50

摘要： A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

摘要翻译： 可以提供激光加工方法和激光加工装置，通过该激光加工方法可以有效地加工成形精度优异的孔。 用于校正第一反射镜和/或第二反射镜的反射面的任何变形的第一柱面透镜和/或第二柱面透镜布置在激光束的光轴上，并且用于X射线的激光束的会聚位置， 分量和Y分量与光轴上的点重合。

公开(公告)号：US07923659B2

公开(公告)日：2011-04-12

申请号：US11843274

申请日：2007-08-22

申请人： Kunio Arai ,  Yasuhiko Kita ,  Yasushi Ito

发明人： Kunio Arai ,  Yasuhiko Kita ,  Yasushi Ito

IPC分类号： B23K26/06 ,  B23K26/073

CPC分类号： B23K26/0648 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/082 ,  B23K26/382 ,  B23K2101/42 ,  B23K2103/50

摘要： A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

摘要翻译： 可以提供激光加工方法和激光加工装置，通过该激光加工方法可以有效地加工成形精度优异的孔。 用于校正第一反射镜和/或第二反射镜的反射面的任何变形的第一柱面透镜和/或第二柱面透镜布置在激光束的光轴上，并且用于X射线的激光束的会聚位置， 分量和Y分量与光轴上的点重合。

公开(公告)号：US06531677B2

公开(公告)日：2003-03-11

申请号：US09970909

申请日：2001-10-05

申请人： Kunio Arai ,  Kazuhisa Ishii ,  Yasuhiko Kita

发明人： Kunio Arai ,  Kazuhisa Ishii ,  Yasuhiko Kita

IPC分类号： B23K2638

CPC分类号： B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/389 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/0038 ,  H05K2203/108

摘要： An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.

摘要翻译： 一种用于钻孔盲孔的改进方法和装置，以连接具有激光的印刷线路板的上导电层和下导电层。 钻孔与目标导电层接触的树脂层用激光保持残留层，残余层用能量密度低于导电层分解能阈值的紫外激光束去除，高于 树脂层。 用于该钻孔的装置具有至少两个激光路径。 空间能量分布由路径中的光束均化器单元制成顶帽形，直径和能量密度独立调整。