发明授权
US07944047B2 Method and structure of expanding, upgrading, or fixing multi-chip package
有权
扩展，升级或固定多芯片封装的方法和结构
- 专利标题： Method and structure of expanding, upgrading, or fixing multi-chip package
- 专利标题（中）： 扩展，升级或固定多芯片封装的方法和结构
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申请号： US11860985申请日： 2007-09-25
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公开(公告)号： US07944047B2公开(公告)日： 2011-05-17
- 发明人: Jong Hoon Oh , Klaus Hummler , Oliver Kiehl , Josef Schnell , Wayne Frederick Ellis , Jung Pill Kim , Lee Ward Collins , Octavian Beldiman
- 申请人： Jong Hoon Oh , Klaus Hummler , Oliver Kiehl , Josef Schnell , Wayne Frederick Ellis , Jung Pill Kim , Lee Ward Collins , Octavian Beldiman
- 申请人地址： DE Munich
- 专利权人： Qimonda AG
- 当前专利权人： Qimonda AG
- 当前专利权人地址： DE Munich
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/34
摘要：
Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.
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