发明授权
US07947332B2 Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
有权
印刷电路板用预浸料，金属箔复合层压板和印刷电路板，以及多层印刷电路板的制造方法
- 专利标题： Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
- 专利标题（中）： 印刷电路板用预浸料，金属箔复合层压板和印刷电路板，以及多层印刷电路板的制造方法
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申请号： US11630651申请日： 2005-06-22
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公开(公告)号： US07947332B2公开(公告)日： 2011-05-24
- 发明人: Nozomu Takano , Kazumasa Takeuchi , Katsuyuki Masuda , Masashi Tanaka , Kazuhito Obata , Yuuji Ooyama , Yoshitsugu Matsuura
- 申请人： Nozomu Takano , Kazumasa Takeuchi , Katsuyuki Masuda , Masashi Tanaka , Kazuhito Obata , Yuuji Ooyama , Yoshitsugu Matsuura
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2004-184856 20040623; JP2004184857 20040623; JP2004-184858 20040623; JP2004-189607 20040628
- 国际申请： PCT/JP2005/011449 WO 20050622
- 国际公布： WO2006/001305 WO 20060105
- 主分类号： B05D3/12
- IPC分类号： B05D3/12
摘要：
A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.
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