公开(公告)号：US20070277375A1

公开(公告)日：2007-12-06

申请号：US11630651

申请日：2005-06-22

申请人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

发明人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

IPC分类号： H05K3/10

CPC分类号： B32B27/04 ,  B29K2105/0872 ,  H05K1/0366 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/53883

摘要： A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.

摘要翻译： 根据本发明的印刷线路板预浸料是通过用热固性树脂组合物浸渍干燥基材而获得的印刷线路板预浸料，当其弯曲90°时，基材中不会发生裂纹。

公开(公告)号：US07947332B2

公开(公告)日：2011-05-24

申请号：US11630651

申请日：2005-06-22

申请人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

发明人： Nozomu Takano ,  Kazumasa Takeuchi ,  Katsuyuki Masuda ,  Masashi Tanaka ,  Kazuhito Obata ,  Yuuji Ooyama ,  Yoshitsugu Matsuura

IPC分类号： B05D3/12

CPC分类号： B32B27/04 ,  B29K2105/0872 ,  H05K1/0366 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/53883

摘要： A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.

摘要翻译： 根据本发明的印刷线路板预浸料是通过用热固性树脂组合物浸渍干燥基材而获得的印刷线路板预浸料，当其弯曲90°时，基材中不会发生裂纹。

公开(公告)号：US08501279B2

公开(公告)日：2013-08-06

申请号：US12091519

申请日：2006-10-19

申请人： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshitsugu Matsuura

发明人： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshitsugu Matsuura

IPC分类号： B32B3/10 ,  B32B15/09 ,  B05D3/02 ,  B05D3/10

CPC分类号： H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/163 ,  Y10T428/24917 ,  Y10T428/261 ,  Y10T428/27

摘要： A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

摘要翻译： 一种制造具有一个或多个层叠体的柔性层叠片的方法，每个层叠体均设置有形成在树脂膜的一侧上的金属箔，该方法包括涂布步骤，其中将包含聚酰胺酸和溶剂的清漆涂覆到 金属箔以形成涂膜，保持在金属箔上形成的涂膜的保持步骤，其中除去清漆中的至少一部分溶剂以形成由树脂构成的层的干燥步骤 组合物和树脂膜形成步骤，其中由树脂组合物组成的层被加热以形成含有聚酰亚胺树脂的树脂膜。 基于树脂膜中的金属元素含量的目标，调整从涂布步骤到树脂成膜步骤的每个步骤的条件。

公开(公告)号：US20090081426A1

公开(公告)日：2009-03-26

申请号：US12091519

申请日：2006-10-19

申请人： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshisugu Matsuura

发明人： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshisugu Matsuura

IPC分类号： B32B3/10 ,  B32B15/08 ,  B05D3/02 ,  B05D3/10

CPC分类号： H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/163 ,  Y10T428/24917 ,  Y10T428/261 ,  Y10T428/27

摘要： A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

摘要翻译： 一种制造具有一个或多个层叠体的柔性层叠片的方法，每个层叠体均设置有形成在树脂膜的一侧上的金属箔，该方法包括涂布步骤，其中将包含聚酰胺酸和溶剂的清漆涂覆到 金属箔以形成涂膜，保持在金属箔上形成的涂膜的保持步骤，其中除去清漆中的至少一部分溶剂以形成由树脂构成的层的干燥步骤 组合物和树脂膜形成步骤，其中由树脂组合物组成的层被加热以形成含有聚酰亚胺树脂的树脂膜。 基于树脂膜中的金属元素含量的目标，调整从涂布步骤到树脂成膜步骤的每个步骤的条件。

公开(公告)号：US07648770B2

公开(公告)日：2010-01-19

申请号：US10557728

申请日：2004-05-21

申请人： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

发明人： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

IPC分类号： B32B15/08

CPC分类号： B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

摘要翻译： 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

公开(公告)号：US07758951B2

公开(公告)日：2010-07-20

申请号：US10591696

申请日：2005-03-04

申请人： Kazumasa Takeuchi ,  Makoto Yanagida ,  Masaki Yamaguchi ,  Katsuyuki Masuda

发明人： Kazumasa Takeuchi ,  Makoto Yanagida ,  Masaki Yamaguchi ,  Katsuyuki Masuda

IPC分类号： B32B27/04 ,  B32B27/12 ,  D04H1/00

CPC分类号： C08J5/24 ,  C08G59/504 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/14 ,  C08K5/3445 ,  C08L63/00 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K2201/0154 ,  Y10T428/12549 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/249941 ,  Y10T428/249951 ,  C08L2666/20 ,  C08L2666/22

摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.

摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。

公开(公告)号：US07871694B2

公开(公告)日：2011-01-18

申请号：US12180384

申请日：2008-07-25

申请人： Kazumasa Takeuchi ,  Makoto Yanagida ,  Masaki Yamaguchi ,  Katsuyuki Masuda

发明人： Kazumasa Takeuchi ,  Makoto Yanagida ,  Masaki Yamaguchi ,  Katsuyuki Masuda

IPC分类号： B32B27/04 ,  B32B27/12 ,  D04H1/00

CPC分类号： C08J5/24 ,  C08G59/504 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/14 ,  C08K5/3445 ,  C08L63/00 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K2201/0154 ,  Y10T428/12549 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/249941 ,  Y10T428/249951 ,  C08L2666/20 ,  C08L2666/22

摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.

摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。

公开(公告)号：US08507100B2

公开(公告)日：2013-08-13

申请号：US12688276

申请日：2010-01-15

申请人： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

发明人： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

IPC分类号： B32B15/08

CPC分类号： B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

摘要翻译： 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

公开(公告)号：US20100119853A1

公开(公告)日：2010-05-13

申请号：US12688276

申请日：2010-01-15

申请人： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

发明人： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

IPC分类号： B32B15/08 ,  B32B27/34 ,  C09J133/24 ,  C08G73/10 ,  C08G18/00

CPC分类号： B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

摘要翻译： 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

公开(公告)号：US20070287021A1

公开(公告)日：2007-12-13

申请号：US10591696

申请日：2005-03-04

申请人： Kazumasa Takeuchi ,  Makoto Yanagida ,  Masaki Yamaguchi ,  Katsuyuki Masuda

发明人： Kazumasa Takeuchi ,  Makoto Yanagida ,  Masaki Yamaguchi ,  Katsuyuki Masuda

IPC分类号： C08J5/24 ,  B32B15/08 ,  C08L63/00 ,  H05K1/03 ,  C08L79/08 ,  C08G73/14

CPC分类号： C08J5/24 ,  C08G59/504 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/14 ,  C08K5/3445 ,  C08L63/00 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K2201/0154 ,  Y10T428/12549 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/249941 ,  Y10T428/249951 ,  C08L2666/20 ,  C08L2666/22

摘要： This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 μm.

摘要翻译： 本发明提供了一种预浸料坯，其通过用与金属箔具有优异粘合性的树脂浸渍薄纤维基材，能够得到具有优异的尺寸稳定性和耐热性的印刷电路板，并且能够以高密度弯曲并容纳在电子器件封装中 或纤维基材，优异的耐热性和高柔韧性，以及使用它的金属箔覆层压板和印刷电路板。 本发明的预浸料通过将含有酰亚胺结构的树脂和热固性树脂的树脂组合物浸渍到厚度为5-50μm的纤维基材中而获得。