Invention Grant
- Patent Title: Process for forming encapsulated electronic devices
- Patent Title (中): 用于形成封装的电子器件的方法
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Application No.: US12323642Application Date: 2008-11-26
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Publication No.: US07947536B2Publication Date: 2011-05-24
- Inventor: Nigel Morton Coe , Kyle D. Frischknecht , Charles D. Lang , Matthew Stainer , Raymond S. Pflanzer
- Applicant: Nigel Morton Coe , Kyle D. Frischknecht , Charles D. Lang , Matthew Stainer , Raymond S. Pflanzer
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.
Public/Granted literature
- US20110081735A1 PROCESS FOR FORMING ENCAPSULATED ELECTRONIC DEVICES Public/Granted day:2011-04-07
Information query
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