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    LIQUID COMPOSITION FOR DEPOSITION OF ORGANIC ELECTROACTIVE MATERIALS
    3.
    发明申请
    LIQUID COMPOSITION FOR DEPOSITION OF ORGANIC ELECTROACTIVE MATERIALS 审中-公开
    用于沉积有机电解材料的液体组合物

    公开(公告)号：US20130256603A1

    公开(公告)日：2013-10-03

    申请号：US13992250

    申请日：2011-12-20

    申请人： Reid John Chesterfield ,  Charles D. Lang ,  Henry J. Sarria ,  Hjalti Skulason

    发明人： Reid John Chesterfield ,  Charles D. Lang ,  Henry J. Sarria ,  Hjalti Skulason

    IPC分类号： H01L51/00

    CPC分类号： H01L51/0034 ,  H01L51/0007 ,  H01L51/56

    摘要： Compositions are provided for improved liquid deposition of electroactive material onto low surface energy layers. The liquid composition includes at least one organic electroactive material in a liquid medium. The liquid medium includes (a) at least 20% by volume, based on the total volume of the liquid medium, of a first solvent and (b) at least 1% by volume, based on the total volume of the liquid medium, of a liquid organic additive. The liquid medium pins on the underlying layer as determined by a dynamic receding contact angle test. The first solvent retracts on the underlying layer as determined by the dynamic receding contact angle test.

    摘要翻译： 提供了组合物，用于改善电活性材料在低表面能层上的液体沉积。 液体组合物在液体介质中包含至少一种有机电活性材料。 液体介质包括（a）基于液体介质的总体积至少20体积％的第一溶剂和（b）基于液体介质的总体积至少1体积％的 液体有机添加剂。 底层上的液体介质针由动态后退接触角测试确定。 第一溶剂通过动态后退接触角测试确定在基层上缩回。

    Process for forming encapsulated electronic devices
    6.
    发明授权
    Process for forming encapsulated electronic devices 有权
    用于形成封装的电子器件的方法

    公开(公告)号：US07947536B2

    公开(公告)日：2011-05-24

    申请号：US12323642

    申请日：2008-11-26

    申请人： Nigel Morton Coe ,  Kyle D. Frischknecht ,  Charles D. Lang ,  Matthew Stainer ,  Raymond S. Pflanzer

    发明人： Nigel Morton Coe ,  Kyle D. Frischknecht ,  Charles D. Lang ,  Matthew Stainer ,  Raymond S. Pflanzer

    IPC分类号： H01L21/00

    CPC分类号： H01L51/5246

    摘要： There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.

    摘要翻译： 这里提供了形成封装的电子器件的方法。 该设备在基板上具有有效区域和密封区域。 该方法包括提供基底; 在所述密封区域的至少一部分上形成具有第一表面能的材料的不连续图案; 形成多个活性层，其中至少一个活性层通过液体沉积形成，所述液体介质具有大于所述第一表面能的表面能; 提供封装组件; 以及将密封组件粘合到密封区域中的基底。 还提供了通过所公开的方法形成的装置。