Abstract:
An apparatus and method for solution coating layers onto a substrate of an electronic device. A slot die coater in conjunction with a vacuum assist device is used in priming, coating and cleaning stations to produce thin layers having performance advantages over competing technologies.
Abstract:
The present invention relates to electrically conductive polymer compositions, and their use in electronic devices. The compositions contain a semi-aqueous dispersion of at least one electrically conductive polymer doped with at least one highly-fluorinated acid polymer, non-conductive oxide nanoparticles, at least one high-boiling organic liquid, and at least one lower-boiling organic liquid.
Abstract:
Compositions are provided for improved liquid deposition of electroactive material onto low surface energy layers. The liquid composition includes at least one organic electroactive material in a liquid medium. The liquid medium includes (a) at least 20% by volume, based on the total volume of the liquid medium, of a first solvent and (b) at least 1% by volume, based on the total volume of the liquid medium, of a liquid organic additive. The liquid medium pins on the underlying layer as determined by a dynamic receding contact angle test. The first solvent retracts on the underlying layer as determined by the dynamic receding contact angle test.
Abstract:
There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy; exposing the treated first layer with radiation; and forming the second layer. There is also provided an organic electronic device made by the process.
Abstract:
There is provided a portable substrate carrier enclosure. The carrier enclosure has a carrier support; a displaceable cover; spacers between the support and cover; a gas inlet; and a removable lid. There is also provided an assembly and a process for depositing an air-sensitive material onto a substrate using the portable substrate carrier enclosure.
Abstract:
There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.
Abstract:
An apparatus and method for vapor phase deposition of a reactive surface area (RSA) material onto a substrate of an electronic device. The vapor phase deposition is conducted at ambient pressures in air, and provides capture of residual vapor to minimize environmental release of RSA and other constituents used in the processing.
Abstract:
In one embodiment, a containment structure (230) for an organic composition (240) is provided. The containment structure (230) includes an undercut layer (210) and an overlying layer (220), wherein the undercut (210) and overlying (220) layers define a volume for receiving the organic composition (240) in liquid form.
Abstract:
There is provided a portable substrate carrier enclosure. The carrier enclosure has a carrier support; a displaceable cover; spacers between the support and cover; a gas inlet; and a removable lid. There is also provided an assembly and a process for depositing an air-sensitive material onto a substrate using the portable substrate carrier enclosure.
Abstract:
A multilayer, photosensitive element comprising a coversheet, a photohardenable layer, a contiguous layer, an isolation layer, an adhesive layer, and a support, is described. The element is used for image reproduction.