Invention Grant
- Patent Title: Flexible eddy current array probe and methods of assembling the same
- Patent Title (中): 灵活的涡流阵列探头及其组装方法
-
Application No.: US11935077Application Date: 2007-11-05
-
Publication No.: US07952348B2Publication Date: 2011-05-31
- Inventor: Haiyan Sun , Yuri Plotnikov , Changting Wang , William Stewart McKnight , Ui Suh
- Applicant: Haiyan Sun , Yuri Plotnikov , Changting Wang , William Stewart McKnight , Ui Suh
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Armstrong Teasdale LLP
- Agent William Scott Andes, Esq.
- Main IPC: G01N27/82
- IPC: G01N27/82 ; G01R33/12
Abstract:
A method of assembling an eddy current probe for use in nondestructive testing of a sample is described. The method includes positioning at least one substantially planar spiral drive coil within the eddy current probe, such that the drive coil is at least one of adjacent to and at least partially within a flexible material. The method further includes coupling at least one unpackaged solid-state magnetic field sensor to the at least one drive coil.
Public/Granted literature
- US20090115411A1 FLEXIBLE EDDY CURRENT ARRAY PROBE AND METHODS OF ASSEMBLING THE SAME Public/Granted day:2009-05-07
Information query
