In one embodiment, the present invention includes a method for selecting first data received in a first die of a multi-chip package (MCP) from a second die of the MCP via an intra-package link for output from a selector during a first clock period of a first clock signal, selecting second data transmitted from the second die to the first die for output from the selector during a second clock period, and transmitting the first and second data from the MCP via an external link. Other embodiments are described and claimed.