Invention Grant
- Patent Title: Assembly device
- Patent Title (中): 装配装置
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Application No.: US12365969Application Date: 2009-02-05
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Publication No.: US07958625B2Publication Date: 2011-06-14
- Inventor: Chia-Hung Lee , Jen-Huan Yu , Chung-Shao Huang , Ching-Feng Hsieh , Cheng-Wen Dai , Kuo-Ching Chen
- Applicant: Chia-Hung Lee , Jen-Huan Yu , Chung-Shao Huang , Ching-Feng Hsieh , Cheng-Wen Dai , Kuo-Ching Chen
- Applicant Address: TW Taipei
- Assignee: Askey Computer Corp.
- Current Assignee: Askey Computer Corp.
- Current Assignee Address: TW Taipei
- Agency: Rabin & Berdo, P.C.
- Priority: TW97140155A 20081020
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K3/36

Abstract:
An assembly device includes a base having a supporting portion upon which an isolation cover and a main body are disposed. A press-fitting mechanism is movably connected to the base, and includes a press-fitting portion facing the supporting portion and disposed corresponding in position to the supporting portion, and further portions for guiding and bending second positioning portions. The further portions are movably disposed on external side faces of the press-fitting portion. The press-fitting mechanism also has first portions for holding the further portions to the external side faces of the press-fitting portion, and has second portions passing through upper ends of the further portions. A drive mechanism is disposed at the base and has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion via the drive portion, so as to bend and fasten ends of second positioning portions.
Public/Granted literature
- US20100095518A1 ASSEMBLY DEVICE Public/Granted day:2010-04-22
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