Invention Grant
- Patent Title: Microengineered electrode assembly
- Patent Title (中): 微电极组件
-
Application No.: US12220321Application Date: 2008-07-23
-
Publication No.: US07960693B2Publication Date: 2011-06-14
- Inventor: Richard Syms , Alan Finlay
- Applicant: Richard Syms , Alan Finlay
- Applicant Address: GB London
- Assignee: Microsaic Systems Limited
- Current Assignee: Microsaic Systems Limited
- Current Assignee Address: GB London
- Agency: Bishop & Diehl, Ltd.
- Priority: GB0714316.7 20070723
- Main IPC: H01J49/42
- IPC: H01J49/42

Abstract:
Microengineered stacked ring electrode assemblies capable of acting as either RF or DC ion guides in an ion optical system, and method of fabricating same are described. The electrodes are fabricated using planar processing as sets of grooved, proud features formed in a layer of material lying on an insulating substrate. Two such structures are then stacked together to form a set of diaphragm electrodes with closed pupils. Arrangements for fabrication by patterning, etching and bonding are described, together with methods for tapering the electrode pupils or otherwise varying the ion path.
Public/Granted literature
- US20090026361A1 Microengineered electrode assembly Public/Granted day:2009-01-29
Information query